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摘要:This paper presents the thermal management of IGBT module with cooling fin.At the time of IGBT module use,mass heat occur the jointed area of IGBT module structure is destroyed by heat destruction and the CTE mismatch of materials.The lifetime of an IGBT module varies significantly depending on materials used and structural design.Therefore Thermal management is influence of IGBT module systems lifetime.Recently The IGBT modules have been developed with thermal man-agement technologies to achieve a smaller size and higher power density.In this time,we investigated thermal designs of IGBT module systems.The following were the main findings:(a) optimization of IGBT chip disposition and using high strength solder,we can achieve high reliability in a large current region.(b) thermal grease thickness and characteristics was influence of IGBT module lifetime.
会议名称:

The 9th International PCIM China Conference

会议时间:

2010-06-01

会议地点:

中国上海

  • 专辑:

    电子技术及信息科学

  • 专题:

    无线电电子学

  • 分类号:

    TN322.8

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