文献知网节
  • 记笔记
摘要:In the present study, a computational model of LED filament light bulb was established by the ANSYS Icepak software based on the finite element method(FEM) and was compared with the experimental data as well. With the developed model, the effects of the filling gas and the filament substrate on the steady-state thermal performance were investigated. The simulation results revealed that the thermal conductivity of the filling gas in the bulb had a significant influence on the heat dissipation of the bulb. Compared with air filling, helium can reduce the average junction temperature of LED chips bonded on the sapphire substrate by 54.6 ℃. With a glass filament substrate and helium filling in the bulb as the base case, the average junction temperature reductions of LED chips bonded on transparent ceramics, sapphire and perforated copper were 9.6 ℃, 11.4 ℃, and 22.4 ℃, respectively. It was found that the higher the thermal conductivity of the filling gas, the less junction temperature change would be resulted from different filament substrates. In conclusion, this model can benefit the optimization of thermal design for a LED filament light bulb.
会议名称:

第十二届中国国际半导体照明论坛

会议时间:

2015-11-02

会议地点:

中国广东深圳

  • 专辑:

    工程科技Ⅱ辑

  • 专题:

    电力工业

  • 分类号:

    TM923.34

  • 手机阅读
    即刻使用手机阅读
    第一步

    扫描二维码下载

    "移动知网-全球学术快报"客户端

    第二步

    打开“全球学术快报”

    点击首页左上角的扫描图标

    第三步

    扫描二维码

    手机同步阅读本篇文献

  • CAJ下载
  • PDF下载

下载手机APP用APP扫此码同步阅读该篇文章

下载:10 页码:108-112 页数:5 大小:1363k

引文网络
  • 参考文献
  • 引证文献
  • 共引文献
  • 同被引文献
  • 二级参考文献
  • 二级引证文献
  • 批量下载
相关推荐
  • 相似文献
  • 读者推荐
  • 相关基金文献
  • 相关法规
  • 关联作者
  • 相关视频